1.6mm side looking infrared emitting diode EAILP02RRHA0 features ? low forward voltage ? peak wavelength p=940nm ? high reliability ? pb free ? this product itself will re main within rohs compliant version. ? compliance with eu reach ? compliance halogen free (br < 900ppm, cl < 900ppm, br+cl < 1500ppm) description ? the e a ilp02rrha0 is a gaalas infrared emitting diode. the miniature side - facing device is a chip that emits radiation from the side of the clear package. applications ? vcr ? floppy disk drive ? automatic stroboscope ? cassette type recorder ? optoelectronic switch ? photo interrupter device selection guide part category chip ma terial s lens color ir ga alas water clear page 1 of 7 rev. 0.01
package dimension note s : 1. all dimensions are in millimeters note s : 2. tolerances unless dimensions 0. 3 m m absolute maximum ratings (ta=25 ) parameter symbol rating units continuo us forward current i f 50 ma reverse voltage v r 5 v operating temperature t opr - 25 ~ +85 ?c storage temperature t stg - 40 ~ + 85 ?c soldering temperature *1 t sol 260 ?c power dissipation at (or below) 25?c free air temperature p d 75 mw *1: soldering time Q 5 seconds. page 2 of 7 rev. 0.01
electro-optical characteristics (ta=25 ) parameter symbol condition min. typ. max. units light current i c (on) i f =4ma,v ce =3.5v 465 -- 1 274 a peak wavelength p i f =20ma -- 940 -- nm spectral bandwid t h ? i f =20ma -- 45 -- nm forward voltage v f i f =20ma -- 1.2 1. 5 v reverse current i r v r =5v -- -- 10 a view angle 21/2 i f =20ma -- 25 -- deg condition : i f =4ma, v ce =3.5v symbol condition ranks min . max . unit ic(on) i f =4ma,v ce =3.5v 6 - 1 650 1274 a 6 - 2 465 750 this bin table is only for reference, not for specific bin shipment. test method for i c(on) : condition: i f =4ma, v ce =3.5v page 3 of 7 rev. 0.01
0 20 40 60 80 100 if =20ma ta=25c -20 0.9 0.7 0.8 1.0 50 70 80 60 40 30 -10 0 20 10 typical electro-optical characteristics curves forward current vs. ambient temperature spectral distribution relative radiant intensity vs. angular displacement forward current vs. forward voltage 0 100 -40 -20 0 20 40 60 80 10 20 30 40 50 60 70 page 4 of 7 rev. 0.01
packing quantity specification 1000 pcs/bag, 8 b ag s /b ox 10 boxes/carton label form specification ? cpn: customer p art number ? p/n: p art number ? qty: packing quantity ? cat: rank s ? ref: reference ? lot no: lot number 1. during lead frame bending, the lead frame should be bent at a distance more than 3mm from bottom of the epoxy. note : must fix lead frame and do not touch epoxy before bending to avoid leds broken. 2. lead forming should be done before soldering. 3. avoid stressing the led package during leads forming. the stress to the base may damage the leds characteristics or it may break the leds. 4. cut the led lead frame at room temperature. cutting the lead frames at high temperatures may cause failure of the leds. 5. when mounting the leds onto a pcb, the pcb holes must be aligned exactly with the lead position of the led. if the leds are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the leds. storage 1. the leds should be stored at 10~30c and 70%rh or less after being shipped from everlight and the storage life limits are 3 months. if the leds are stored for 3 months or more, they can be stored at 10 c ~ 25 c and 20 %rh~60%rh for a year in a sealed container with a nitrogen atmosphere. after opening the package, the devices must be stored at 10c ~ 25 c and 20 %rh~60%rh, and suggested to be used within 24 hours or as soon as possible. besides, suggest that the remaining devices seal in the package bag as soon as possible please. 2. please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. page 5 of 7 rev. 0.01
soldering 1. careful attention should be paid during soldering. when soldering, leave more tha n 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. 2. recommended soldering conditions: hand soldering dip soldering temp. at tip of iron 300 c max. (30w max.) preheat temp. 100 c max. (60 sec max.) soldering time 3 sec max. bath temp. & time 260 max., 5 sec max distance 3 mm min.(from solder joint to epoxy bulb) distance 3 mm min. (from solder joint to ep oxy bulb) 3. recommended soldering profile 4. avoiding applying any stress to the lead frame while the leds are at high temperature particularly when soldering. 5. dip and hand soldering should not be done more than one time 6. after soldering the leds, the epoxy bulb should be protected from mechanical shock or vibration until the leds return to room temperature. 7. a rapid-rate process is not recommended for cooling the leds down from the peak temperature. 8. although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the leds. 9. wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. cleaning do not clean the leds by the ultrasonic. heat management 1. heat management of leds must be taken into consideration during the design stage of led application. the current should be de-rated appropriately by referring to the de-rating curve found in each product specification. 2. the temperature surrounding the led in the application should be controlled. please refer to the data sheet de-rating curve. prehead laminar wave fluxing page 6 of 7 rev. 0.01
esd (electrostatic discharge) 1. the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. 2. when handling the products , the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials 3. proper grounding is required for all devices, equipment, and machinery used in product assembly. surge protection should be considered when designing of commercial products 4. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommend ed: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers directions for use the leds should be operated with forward bias. the driving circuit must be designed so that the leds are not subjected to forward or reverse voltage while it is off. if reverse voltage is continuously applied to the leds, it may cause migration resulting in led damage. disclaimer 1. everlight reserves the right(s) on the adjustment of product material mix for the specification. 2. the product meets everlight published specification for a period of twelve (12) months from date of shipment. 3. the graphs shown in this datasheet are representing typical data only and do not show guaranteed values. 4. when using this product, please observe the absolute maximum ratings and the instructions for us ing outlined in these specification sheets. everlight assumes no responsibility for any damage resulting from the use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 5. these specification sheets include materials protected under copyright of everlight. reproduction in any form is prohibited without obtaining everlights prior consent. 6. this product is not intended to be used for military, aircraft, automotive, medical, life sustaining or life saving applications or any other application which can result in human injury or death. please contact authorized everlight sales agent for special application request. page 7 of 7 rev. 0.01
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